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    • Electrically Conductive Solution
      • CNT Dispersion solution
      • Conduoctive compund/masterbatch
      • Self-assembly anisotropic conductive paste(SACP)
    • Thermally conductive solution
    • Lubricating & Cooling Solution
      • Cutting eco-friendly water
      • Releasing agent
    • CFD(Computational Fluid Dynamics)
      • TSE simulation
      • Dispersion/mixing simulation
      • Cooling/heating simulation
      • Cast solidification simulation
    • Particle Surface Treatment
      • Conductive coating
      • Silane hydrophobic / Hydrophilic modification
      • Foreign particle coating
      • Insulating coating
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Product

  • Electrically Conductive Solution
    • CNT Dispersion solution
    • Conduoctive compund/masterbatch
    • Self-assembly anisotropic conductive paste(SACP)
  • Thermally conductive solution
  • Lubricating & Cooling Solution
    • Cutting eco-friendly water
    • Releasing agent
  • CFD(Computational Fluid Dynamics)
    • TSE simulation
    • Dispersion/mixing simulation
    • Cooling/heating simulation
    • Cast solidification simulation
  • Particle Surface Treatment
    • Conductive coating
    • Silane hydrophobic / Hydrophilic modification
    • Foreign particle coating
    • Insulating coating

Twin Screw Extrusion Simulation

TSE(Twin Screw Extrusion) Simulation (Ludovic)

Features of TSE simulation - Ludovic



Micro-Composite, Inc. Address : 2F., Cheomdan-ro 245Beon-gil 50, Danwon-gu, Ansan-si, Gyeonggi-do, Republic of Korea
TEL : 82-31-491-9003, FAX : 82-31-493-9571

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